Purpose
To evaluate the thermal performance of LOPE PC chassis designed by Well Industrial Design including operating temperature of critical components and volumetric airflow rate of fans and vent.

 

Theory and Analysis

The temperature measurement was performed at room temperature and power dissipation of critical components were simulated by ceramic heaters. To predict the real operating temperature of critical components Newton's law of cooling was applied. First law of thermodynamics was adapted to calculate air temperature.

 

Example
Table1. Case Temperature of CPU
Experiment
1.3G
1.4G
1.5G
Power Dissipation(W)
50.0
48.9
51.8
54.7
System Ambient Temperature(°C)
25.0
35.0
35.0
35.0
CPU Inlet Temperature(°C)
30.0
40.0
40.0
40.0
Temperature Rise(°C)
20.0
19.6
20.7
21.9
CPU Case Temperature(°C)
50.0
59.6
60.7
61.9

 

Equipment and Instruments
NAME
MODEL NUMBER
SERIAL NUMBER
RESOLUTION
Data Logger
FLUKE NetDAQ 2640A
7034411
0.0001
Thermocouple
OMEGA TT-T-36
0.75%
DC Power Supply
Chroma 6210-40
37750
40V/25A
0.1V/0.01A
DC Power Supply
Topward 6306D
994227
60V/6A
0.1V/0.01A
DC Load
Chroma 6314/63102
63140254
0.01V/0.001A/0.1W
Digital Multimeter
GW GDM-8045G
2110443
0.01V/0.01µA/0.01
Micromanometer
FCO 14
9805111,9805112
0.1%

 



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